doc. no : qw0905- rev. : date : a 05 - sep-2008 LHG35162-PF-1008 bipolar type led lamps pb LHG35162-PF data sheet lead-free parts ligitek electronics co.,ltd. property of ligitek only
ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 75% 100% -60 25% 50%25% 0 directivity radiation 0 -30 LHG35162-PF package dimensions part no. 100% 50%75% 60 30 page1/6 25.0min 2.54typ 1.0min 0.5 typ 1 2 1 2 7.01 1.76 1.5max h g 1.7 3.95
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) unit ligitek electronics co.,ltd. property of ligitek only page power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current t opr tstg ir -40 ~ +85 -40 ~ +100 10 a 50 60 20 i f pd i fp symbol 15 ma 80 50 mw ma red ratings green absolute maximum ratings at ta=25 2/6 part no.LHG35162-PF material gap LHG35162-PF gap part no viewing angle 2 1/2 (deg) 50 50 peak wave length pnm 30 90 red 697 white diffused green 565 lens emitted 1.72.10.5 0.25 1.72.18.0 4.5 min. typ.typ. min. spectral halfwidth nm color luminous intensity @10ma(mcd) forward voltage @10ma(v)
1.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 1.0 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 600 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 1.0 wavelength (nm) 800 7001000 900 -40 fig.5 relative intensity vs. wavelength 0.8 0.9 ambient temperature( ) 0 -2020406080100 80 ambient temperature( ) -40 0.0 -20 1.0 0.5 40 20 060100 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) 1.0 fig.3 forward voltage vs. temperature 1.1 1.2 0.1 forward voltage(v) 2.03.04.05.0 fig.1 forward current vs. forward voltage 1.0 10 100 1000 fig.4 relative intensity vs. temperature 2.0 2.5 3.0 forward current(ma) 1.0 0.0 101001000 fig.2 relative intensity vs. forward current 2.5 0.5 1.0 2.0 1.5 3.0 ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve page3/6 part no.LHG35162-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 500550600650 0.0 0.5 1.0 g chip 4/6 part no.LHG35162-PF
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 25 2 /sec max preheat 0 0 50 120 260 temp( c) 5 /sec max time(sec) 100 150 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 5/6 part no.LHG35162-PF
mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 ligitek electronics co.,ltd. property of ligitek only solderability test solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. reliability test: thermal shock test high temperature high humidity test low temperature storage test high temperature storage test operating life test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test itemtest condition this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description reference standard page 6/6 part no.LHG35162-PF
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